SIERRA COMPONENTS’ WAFER PROCESSING CAPABILITIES INCLUDE:

FOR PROTOTYPE QUANTITIES OR HIGH-VOLUME PRODUCTION RUNS:

Sierra Components is the answer to any wafer dicing requirements. We can dice wafers in preparation for assembly or for Die Sales shipments to customers anywhere in the world, specializing in quick turn dicing. All of our dicing is done utilizing our World-Class Disco DAD3240 and Kulicke & Soffa Precision Dicing System. Our highly experienced operators are experts in handling wafers of all types. We can provide 100% die inspection to MIL-STD-883 or Commercial specifications or we will train and certify our die inspectors to your custom specification.

Whether you need thousands of dice per month or 100 die today, Sierra Components is the supplier to choose. We have built our reputation on providing customers with excellent quality and superior service in the die distribution business, now let us show you what we can do for your wafer processing requirements.